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BGA Re-work
RGL has purchased a Zevac Onyx 29 BGA rework machine and a BX100 two dimensional X-ray facility. This equipment will enable RGL to provide an extensive high quality re-work facility for virtually all SMD devices using either lead or non lead based solders.
Key features include:
- Repeatable positioning accuracy of 5 µm 3 sigma
- Closed loop force placement accuracy of 0.01 newton (1g)
- Board thicknesses up to 6mm multilayer
- Maximum component size of 75mm x 75mm
- Maximum board width of 510mm length virtually unlimited
- High level of automation and easy placement for BGAs as well as gull wing and J leg devices. Ideal for processing modifications or small production runs.
- Automated removal of RF shields, SMD sockets and connectors
- Focused nozzle capability allowing rework where component density is a factor
- Two dimensional X-ray inspection machine
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If you would like to find out more, please contact Stephen Barnett on tel. +64-7-850 4646 or stephen.barnett@repairgroup.co.nz
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